Hi
TechNetters,
Is there any standard (IPC or otherwise)
that details the requirements and the process of baking bare PC boards prior to
assembly? It is standard practice to bake boards that have been stored in
high humidity conditions for long periods. These boards will have absorbed
moisture and will need drying before wave soldering to prevent outgassing.
This should not be an issue with surface mount boards that will be reflowed.
Given that the baking process will accelerate pad oxidization, is there any good
reason to bake SMT boards?
Harinder
Jassal
Manager, Manufacturing Engineering
Aimtronics Corporation (Delta)
Tel: 604-946-9666
Direct: 604-940-5712
Fax: 604-946-7611