Werner, Package looks visual fine on the reflowed boards hence my comment. Perimeter joints visually look fine too. Per our test folks, it passes when they apply the thump pressure on the BGA. This package is TBGA package. re, ken patel -----Original Message----- From: Werner Engelmaier [mailto:[log in to unmask]] Sent: Monday, January 22, 2001 3:09 PM To: [log in to unmask] Subject: Re: [TN] Urgent...Open underneath the BGA Hi Ken, When you say "BGA package looks sturdy to handle the heat", what to you mean? BGAs with Cu heat spreader sure look sturdy, but can warp like potato chips when heated. Werner Engelmaier ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------