Dear Mrs. / Mr. I'm looking for adhesive design rules for SMD packages that are suitable for wave solder application. For the definition of DFM parameters in our CAE system, I would like to know the dot size, dot location etc. per SMD package for a stencil printing process and/or Dispensing process. Taking in account the repairability of the SMD, without damaging the printed circuit board. Who can help me with info about this subject. -- Best Regards, Marius Geurts Manufacturing Quality Engineer Electronics Research & Development Oce Technologie B.V. The Netherlands IPC member --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------