Dear Mrs. / Mr.

I'm looking for adhesive design rules for SMD packages that are suitable
for wave solder application.

For the definition of DFM parameters in our CAE system, I would like to
know the dot size, dot location etc. per SMD package for a stencil
printing process and/or Dispensing process.
Taking in account the repairability of the SMD, without damaging the
printed circuit board.

Who can help me with info about this subject.

--
Best Regards,

Marius Geurts

Manufacturing Quality Engineer Electronics
Research & Development
Oce Technologie B.V.
The Netherlands

IPC member

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