Yes, been spending much time in there...The lifting is isolated to very small areas (in comparison to the panel size) around .050". Of course it is identified under trace's after developing (AOI) and etch (AOI and visual inspection). My thoughts are it is also debris trapped under the resist and not a contaminate of the copper itself, if this makes sense. Any advice from all of you on DOE's performed in this area would be helpful, I'm developing one at the moment but want to make sure I include appropriate variables. Thanks, Franklin --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------