Yes, been spending much time in there...The lifting is isolated to very
small areas (in comparison to the panel size) around .050".

Of course it is identified under trace's after developing (AOI) and etch
(AOI and visual inspection).

My thoughts are it is also debris trapped under the resist and not a
contaminate of the copper itself, if this makes sense.

Any advice from all of you on DOE's performed in this area would be
helpful, I'm developing one at the moment but want to make sure I
include appropriate variables.

Thanks,

Franklin

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