Franklin, I might take some time in the old clean room looking at your film, light sources, and exposure units. It could be a vacuum issue, but I doubt it. Does the lifting occur in only one spot similar to trapped debris, or does it run along the traces for some length? I'm no expert in exposure, but when we have problems, its usually from some area within our clean rooms. Hope this helps. Regards, Sean Clinton Sanmina Plant 3 Santa Clara, CA Brian Ellis wrote: > Sounds as if it may be that someone has no face mask on when coughing > (serious). I had this happen once in a former life. Took a week to track > it down. > > Brian > > Franklin D Asbell wrote: > > > > Happy Holidays people... hope things are going well for everyone... > > > > I have some questions regarding lifted resist problems, our Process > > Engineer is quite convinced we have a resist lifting problem due to the > > double-treat and drum-treat laminates we purchase. > > > > What we have been seeing are very isolated areas of resist lifting after > > developing, areas down space lengths around 50 75 mils long. I have not > > seen any total separation from the copper but I have seen lifted edges, > > again, in very isolated areas, typically not more than 1 instance per > > panel, and then only on appr 10% - 15% of the total panel lot. > > > > We identify this at AOI prior to etch. > > > > I don't have the camera here or i'd snap a few pics for you, even then I > > don't think it'd turn out well as they are very small areas. > > > > Anyway, I find it hard to believe contaminates on foil, responsible for > > lifting resist can occur in such minute areas and so infrequent > > throughout the lot. > > > > Any assistance would be appreciated, thanks > > > > Franklin D Asbell > > Network Circuits > > Irving, Texas ~tucking the Cowboys banner down under the desk, out of > > sight, grin~ > > > > --------------------------------------------------------------------------------- > > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > > To unsubscribe, send a message to [log in to unmask] with following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL > > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > > --------------------------------------------------------------------------------- > > --------------------------------------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------