Ryan,

Will you be "at liberty" to share your findings with TechNet??

If so, I'm certain a lot of us would like to see your data and results.

DT



At 08:38 AM 12/20/00 -0700, you wrote:
>         Hi All,
>
>         I've just been given an open ticket to conduct a surface finish qual
>for immersion silver and immersion tin.  Anybody have suggestions about what
>aspect of the finish to test?
>
>         The surface will be used at SMT, thru-hole, press fit, and ICT (test
>points).  (No wirebonding or contacts).  Edge plating may be necessary for
>certain designs that ground the board to the chassis by sliding the board
>into fingered slots.
>
>         We are looking for a replacement of immersion gold, but don't want
>to deal with the assembly issues with HASL or OSP.
>
>         What I would like most is maintaining solderability WITHOUT taking
>special precautions.  (At least, no more than must be done with gold).
>
>Thanks
>
>Ryan Grant
>Advanced Technology Engineer
>MCMS
>(208) 898-1145
>[log in to unmask]
>
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