Season's Greetings to All Could some one please cast some light for me on the following contrasting information regarding the pad size for pbga and microbga: Quoting from IPC-7095 Design and Assembly Process Implementation for BGA ( May 1999 Proposal Issue): On Para. 6.2 Attachment Sites "6.2.1 Big Vs Small Land and impact on routing: The diameter of the solder land can affect both the reliability of the solder joint and also the routing of conductors. Several studies have shown that large solder land (up to 0.8 mm in diameter ) increase the fatigue life of PBGA packages. However the larger the lands, the less room for routing between lands." On the other hand , quoting from an application note published by Amkor: http://www.amkor.com/customer_center/assembly_and_test/white_papers/appnotes _0800.pdf on page 13 : "'life increases by up to 20% for smaller PCB pads" Which makes sense from the point of getting a higher standoff. Obviously both sources refer to the issue, when one has the option, which is limited anyhow , in which way to go, whether to increase or decrease the pad size . Mickey ECI Telecom