George, Are you putting nomenclature directly on bare copper? We have no problems with nomenclature on soldermask, its when we put the nomneclature directly on copper and then put it through an immersion process. I think we might be experiencing one of two things, (1) undercut from micro etch and replacement mechanism or (2) chemical bond attack between the copper and nomenclature surfaces. What are your thoughts? What nomenclature ink are you using? Lisa "Wenger, George M (George)" <[log in to unmask]>@IPC.ORG> on 12/21/2000 04:13:38 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to "Wenger, George M (George)" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> To: [log in to unmask] cc: Subject: Re: [TN] Nomenclature with Immersion Tin/Silver Lisa, Most of our boards are SMOBC and many have nomenclature ink applied before the final surface finish is applied. To the best of my knowledge, our board vendors haven't had problems processing boards with nomenclature ink through IAg, OSP, or HASL. Regards, George George M. Wenger DMTS Bell Laboratories Princeton, Supply Network Solutions Engineering Research Center FMA / AQA / RCA Lab (609) 639-2769 (Office); 3210 (Lab); 2343 (Fax) [log in to unmask] -----Original Message----- From: Lisa Angle [mailto:[log in to unmask]] Sent: Thursday, December 21, 2000 3:46 PM To: [log in to unmask] Subject: [TN] Nomenclature with Immersion Tin/Silver All, I was wondering how you go about putting nomenclature on copper surfaces and subsequently processing thru immersion tin or immersion silver without experiencing nomenclature peel? I have of course thought of the alternative which is to process the boards thru immersion processes and subsequently nomenclature them, however, our current inks require a long cure time and very high temperature which artificially ages the finishes. Thanks. Lisa Angle Alternative Surface Finish Engineer Teradyne ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------