Dear Technetters: Can anyone provide some basics as to pulse plating of acid copper. General equipment needs and advantages compared to constant plating of same. Thanks in advance. Russell Burdick Process Engineer, Mosaic Printed Circuits _________________________________________________________________ Get your FREE download of MSN Explorer at http://explorer.msn.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------