Hello out there:
This message of help could have been
summited by another but I still need some advice or opinion, Thanks. We are
experiencing problems with voiding in small holes (not too small .35mm 0.014)
and some larger holes at random times. We use a Direct Metalization process for
hole prep. with a palladium base. I realize the problem of bubbles and
foreign objects in holes and such after drill (high pressure rinse after deburr
and vibrate on line) but we are still getting a panel or two at random on too
often occasions. We have the line checked daily to be sure we are in spec.
chemically and mechanically, the voids are still happening too often here as of
late. Is there anyone out there experiencing this problem with the direct
metalization process? I did some panels with panel plate and direct metal plate
side by side and couldn't create the problem. Any ideas or help would sure be
appriciated.
Thanks in advance
Frank