Albert, The Alternate Final Finishes section of the IPC Assembly and Joining Committee is trying to correlate time, temperature, and humidity during storage with solderability, as measured by wetting balance. We have the following finishes in test - bare copper, reflowed tin/lead plate, OSP, electroless nickel/immersion gold, immersion silver, and immersion tin. Various combinations of aging are being tested in a designed experiment to see if we can develop mathematical relationships for combinations. The final data is now being taken, and a preliminary report will be given at IPC Apex, and a full report should be done by IPC Expo. Hopefully, the data can be used by the IPC J-003 Solderability Committee to do exactly what you want and project solderability of aged surface finishes. "Steam aging" really should be called "prediction of solderability under high heat and extreme humidity, not necessarily representative of long term storage of tin lead finishes". However, suffice it to say, steam aging is a better predictor than most any test we have come up with for TIN/LEAD coatings only. Dennis Fritz MacDermid, Inc Chairman - Alternate Final Finishes Task Group. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------