Glenn, Thanks for the reference. I'm not sure if Ryu needs to replace a pad on the BGA component, or board surface, but we detail the following on our web site: Surface Mount, BGA Pad Repair, Film Adhesive Method http://www.circuittechctr.com/guides/4-7-3.htm Surface Mount, BGA Pad with Integral Via Repair http://www.circuittechctr.com/guides/4-7-4.htm Hope this helps, Jeff Ferry CEO Circuit Technology Center www.circuittechctr.com Chairman IPC Rerpairability Committee On Wed, 1 Nov 2000 15:02:14 -0800, Pelkey, Glenn <[log in to unmask]> wrote: >Check out this article...may be useful. No personal experience with it. > >Glenn > >"The case of the Missing Surface-Mount Pads," J. Ferry. Circuits Assembly, >June 2000. > >htttp://www.circuitsassembly.com > >> -----Original Message----- >> From: Ryu [SMTP:[log in to unmask]] >> Sent: Wednesday, November 01, 2000 8:20 AM >> To: [log in to unmask] >> Subject: [TN] Is it possible to repair BGA pad? >> >> During a reballing process, we accidentally removed a pad from the BGA >> substrate in the cleaning >> process. Is there any reliable method to attach the pad back to the >> substrate? or should we >> re-use the part at all. Thanks . > >--------------------------------------------------------------------------- ------ >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 >--------------------------------------------------------------------------- ------ --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------