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Never had the pleasure to work with Direct Metalization but as I've been reminded me in the past - chemistry doesn't think. There has to be something different about those holes - you've already mentioned bubbles and foreign objects what about trapped solution? (Getting a good rinse between steps?) Have you checked hole wall quality where you are getting voids? (If you aren't in charge of Drill that must be where the problem is right . . . <wink wink nod nod>)

Oh yeah, what kind of voids? Any pictures?

Waiting to hear what the Plating gurus suggest.

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Hans M. Hinners
Process Engineer
Toppan Electronics, Inc.
770 Miramar Road
San Diego, CA 92126
(858) 695 - 2222 ext. 241
(858) 695 - 6823 fax
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We are experiencing problems with voiding in small holes (not too small .35mm 0.014) and some larger holes at random times. We use a Direct Metalization process for hole prep. with a palladium base. I realize the problem of bubbles and foreign objects in holes and such after drill (high pressure rinse after deburr and vibrate on line) but we are still getting a panel or two at random on too often occasions. We have the line checked daily to be sure we are in spec. chemically and mechanically, the voids are still happening too often here as of late. Is there anyone out there experiencing this problem with the direct metalization process? I did some panels with panel plate and direct metal plate side by side and couldn't create the problem. Any ideas or help would sure be appriciated.