Good morning everyone. I need some input from you guys. We have a product (pcb assembly) in which we needed to "press in" a PEM spacer. Unfortunately when we pressed in the spacer, it has caused stress cracks in the pcb. I have looked in the IPC-A-610 to find out acceptable and rejectable criteria for stress cracks, however, I have not been able to find any. The closest I can come is crazing. However, the defect appears to be more of a stress crack then crazing. Need help. Is there any other accept/reject criteria or anyone else experience with stress cracks from pressing in hardware. Please advise. Rich --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------