-----Original Message----- From: Jane Koh [mailto:[log in to unmask]] Sent: Tuesday, November 07, 2000 3:38 PM To: [log in to unmask] Subject: [TN] Manual Stencil Cleaning Hi everybody, The IPC Stencil Cleaning Task Group, 5-31g, is currently working on a new document - IPC-7526 "Stencil and Misprinted Board Cleaning Handbook". On behalf of the task group leaders, Kantesh Doss, Nokia Telecommunications, and Mike Bixenman, Kyzen Corporation, I would like to invite input from the industry on the cleaning of stencils and misprinted boards using manual techniques. We would really appreciate if you could share with us how you manually remove solder paste and uncured SMT adhesive from the underside of stencils and misprinted PWBs:- 1. What manual cleaning instruments/accessories do you use? Paste: Saturated wipe, Spatula, Adhesive: Q-tip with Saturated wipe or dip & brush 2. What chemistry do you use? Paste: Smart Sonic 440R Adhesive: Petroferm Hydrex A+ Are you using the same type of cleaning media for removing solder paste and uncured adhesive? No. 3. What is you maximum allowable time lag between a print step and the removal of Solder paste: 4hrs Adhesive: 1hr 4. At what temperature do you perform you stencils/misprinted boards cleaning? 23C 5. How often do you clean your stencils? After job is run. 10+ stencils per day are cleaned. 6. What are the pros and cons of the method you are using? Laborious, time consuming and quality is operator dependent 7. Would you consider changing to an automated system? Paste stencils are currently being run in an automated system, above manual cleaning is to remove majority of paste prior automated cleaning. Mike Barmuta Staff Engineer Fluke Corp. Everett WA 425-356-6076 You may submit your input to me at [log in to unmask] Thank you in advance for your generosity in sharing your knowledge and experiences. Cordially, Jane Koh Technical Project Manager Staff Liaison for the IPC Stencil Cleaning Task Group Tel : (847) 790-5349 Fax: (847) 509-9798 E-mail : [log in to unmask] ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------