Hi Scott - Rockwell Collins has investigated immersion gold/nickel, OSP, immersion tin and immersion silver as alternative solderable finishes. The details of the testing can be found in the following papers: " A Comparison of Immersion Gold/Electroless Nickel, HASL, and OSP Surface Finishes for A Chip Scale Packaging Assembly Application", IPC National Conference: A Summit on Surface Finishes and PWB Solderability, Proceedings, September 1999. "An Investigation of the Effects of Printed Wiring Board Surface Finish and Conformal Coating for BGA Assembly", IPC APEX Conference, Proceedings, March 2000. We have begun successfully using each of the various coatings for a number of programs. Each alternative finish has both positive's and negative's depending on your soldering process, type of assembly, and use environment. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] "Lefebvre, Scott" <[log in to unmask]>@IPC.ORG> on 11/03/2000 05:45:24 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to "Lefebvre, Scott" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> To: [log in to unmask] cc: Subject: [TN] Board Whit Tin finish I wanted to know what is the consensus on White Tin finish for replacement of tin lead HASL. Is it compatible with today's component finishes and the Lead free finishes of tomorrow. I was told Nickel Gold is preferred but I've had issues with gold embattlement, and the cost is also a factor. The gold we have on some of our assemblies has about 5 micro inches and I still do not get as nice of a solder joint as tin lead. Scott Lefebvre Process Engineer --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------