Jim, We've been in production with IAg surface finish since the fall of 1997. We've shipped over a million circuit pack assembles build on IAg boards. We buy IAg boards at no cost adder over HASL. There have been several papers on IAg: 1. Ford presented a paper at the IPC Second Annual National Conference: A Summit on Surface Finihes and PWB Solderability in September 1998 at Austin, TX 2. At the Third Annual Conference in September 1999 at Irvine, CA there were three papers: 2a. Julie ANnn-Scheyer Furanz, et.al. from Intel, "Manufacturability and reliability Evaluation of Immersion Silver", I believe this was also presented at IPC Expo 2000 in Long Beach 2b. George Wenger & Robert Furrow et. al., from Lucent, "Immersion Silver Surface Finish: Usage Requirement Test Results & production Experience" 2c. Ron Inman, et. al, "Results of the CCAMTF Evaluation of Alternative Surface Finihes for Circuit Card Assemblies 3. We also gave an update of the Lucent Immersion Silver Surface Finish paper at AESF SUR/FIN 2000 in Chicago in June 2000 Regards, George George M. Wenger, DMTS Bell Laboratories Princeton Supply Network Solutions PO Box 900, Princeton NJ 08542-0900 Route 569 Carter Rd., Hopewell, NJ 08525 (609)-639-2769 (Office), 3210 (Lab), 2343 (Fax) [log in to unmask] -----Original Message----- From: Jim McMurry [mailto:[log in to unmask]] Sent: Monday, November 06, 2000 6:05 AM To: [log in to unmask] Subject: [TN] IMMERSION SILVER SURFACE FINISH Jim McMurry@PATAPSCO 11/06/2000 09:05 AM I am interested in hereing from anyone who may be using or may have used immersion silver finish on production or prototype pcb's. I would like to know the good and bad sides of this finish. If there are any information resources available on the subject. Are there any cost comparisons? Thank you all for your time and response. ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------