Is there a concern of tin whisker growth with the white tin process? How does this differ than plain old tin plating? Thanks, Jim M. -----Original Message----- From: Franklin D Asbell [SMTP:[log in to unmask]] Sent: Monday, November 06, 2000 7:20 AM To: [log in to unmask] Subject: Re: [TN] Board Whit Tin finish Scott, The immersion 'white' tin process is not as costly to maintain as a nickel/gold process. When properly maintained the finish applied to surface mount pads will be excellent for solderability even after a short shelf-life (3 - 6 months) if the product is packaged appropriately. It is compatible with component finishes and I've never heard of it being incompatible with available assembly processes. One thing to consider also, handling after the immersion process. Here we handle the product as though it were an OSP process including slip-sheets, individual bagged when necessary, dessicant packaged to protect from moisture...etc...etc... Hope this helps. Franklin ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------