Benjamin,

In reference to your second point. If you refer to the cracking of the surface plating or cracking which propogates through the surface copper after electroless plating it is probably due to the difference in ductility or stress between electroless nickel plating and electrolytic nickel plating. Electroless nickel plating tends to be more brittle and will not flex as easily as a low stress sulfamate or watts type electrolytic nickel plating.

I am no plating expert but this is probably the area you should investigate.

Regards,

John Bushie

North American and Asian Technical Services and Application Engineering Manager

Taconic Advanced Dielectric Division


From: Benjamin Zhu <[log in to unmask]>
Subject: [TN] Immersion Gold Problems
Date: Tue, 28 Nov 2000 17:28:12 +0800
To: [log in to unmask]

Hello All,

I'd like to know the = production=20 sequence of Immersion Gold.

1.Should Thermosetting = silkscreen=20 finished before immersion gold because high temperature will oxidize = nickel=20 beneath gold and influence solderability? What about UV = silkscreen?

2.When we apply = immersion gold on=20 flexible PCB, the surface crack is the result. But after electroplating = gold,=20 everything is perfect. Why?

Thank You for your = quick=20 answer!

 

Benjamin=20 Zhu

--- End of Original Message


John Bushie
North America and Asia Technical Services Manager
----------------------------------------------------------
Taconic Advanced Dielectric Division
136 Coonbrook Rd.
Petersburg, NY 12138
Phone:630-834-8676
Fax: 630-834-8681
Email:[log in to unmask]
Date: 11/29/00
Time: 08:53:57
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