Unfortunately Bev, it is definitely not "black pad." Totally random pads completely or partially fail to wet leaving blob of solder on apparently clean gold surface - we see this on small BGA lands and 1206 lands Thanks > -----Original Message----- > From: Bev Christian [SMTP:[log in to unmask]] > Sent: Tuesday, November 28, 2000 1:14 PM > To: 'TechNet E-Mail Forum.'; 'Burtt, Nigel' > Subject: RE: [TN] Ni/Au solderabilty > > Nigel, > When you say random, how random? Does it appear to mainly happen to small > pads connected to large pads elsewhere on the boards? If so, read up on > black pad syndrome in the TechNet archives. > > regards, > Bev Christian > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------