Unfortunately Bev, it is definitely not "black pad." Totally random pads
completely or partially fail to wet leaving blob of solder on apparently
clean gold surface - we see this on small BGA lands and 1206 lands

Thanks

> -----Original Message-----
> From: Bev Christian [SMTP:[log in to unmask]]
> Sent: Tuesday, November 28, 2000 1:14 PM
> To:   'TechNet E-Mail Forum.'; 'Burtt, Nigel'
> Subject:      RE: [TN] Ni/Au solderabilty
>
> Nigel,
> When you say random, how random?  Does it appear to mainly happen to small
> pads connected to large pads elsewhere on the boards?  If so, read up on
> black pad syndrome in the TechNet archives.
>
> regards,
> Bev Christian
>
>

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