Anyone out there got more than their fair share of problems with solderability on PCBs with electroless Ni/Au surface finish at the moment? We have had problems before from a supplier, with Ni/Au boards poorly dried after the final rinse and others with copper contamination in the acid clean bath, but this looks like it might be a new cause. Phosphorous content does not seem to be relevant. Thanks Nigel Burtt Production Engineering Manager Dolby Labs Inc - European HQ Email: [log in to unmask] Tel: +44 (0)1793 842132 [direct line with voicemail] Fax: +44 (0)1793 842101 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------