hi, as you are probably well aware, steam aging is a test that tells you something about the shelf life of a finished surface in a relatively short amount of time. your problem is correlating the test parameters to your local conditions (storage time, temperature, humidity). if you store your boards in a vacuum environment, a steam aging test probably would be of no use to you. if you store your bare boards in a warehouse with an uncontrolled, tropical environment, a steam age test would be valuable. a second problem you will face is getting your pwb fabricator to accept this test. your procurement drawing could specify an exception to this 'tin/tin-lead, only' condition for j-std-003 if that is what you want to do. phil -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Tuesday, November 21, 2000 4:39 AM To: [log in to unmask] Subject: [TN] Fw:Steam Aging Dear Technetters, For IPC-J-STD-003, the solderability test after steam aging is only for tin and tin/lead coatings board. Why is this? For other coatings board, say gold or silver, do the test have the mean? If have, how can I do the test? Where can I find the description about these? Please tell me. Thanks! Best Regards, > > Albert Lai > E-MAIL : [log in to unmask] <mailto:[log in to unmask]> --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------