Check out this article...may be useful. No personal experience with it. Glenn "The case of the Missing Surface-Mount Pads," J. Ferry. Circuits Assembly, June 2000. htttp://www.circuitsassembly.com > -----Original Message----- > From: Ryu [SMTP:[log in to unmask]] > Sent: Wednesday, November 01, 2000 8:20 AM > To: [log in to unmask] > Subject: [TN] Is it possible to repair BGA pad? > > During a reballing process, we accidentally removed a pad from the BGA > substrate in the cleaning > process. Is there any reliable method to attach the pad back to the > substrate? or should we > re-use the part at all. Thanks . --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------