As many of you, I have spent time designing, fabricating, and assembling
hybrid thick and thin film circuits. Just never found the "perfect" ceramic
to metal seal.

Have done Kovar/glass to metal seals as common practice. Have generally had
good experiences with epoxy seals.

Now, I'm faced with another "typical" seal type as Alloy 42/solder/solder to
ceramic with mating metallization.

My question is, considering the difficulty of always soldering effectively
to the alloy, what works well? I'm talking here about the "cans" placed and
sealed, maybe, to the substrate. Alternatives?

Earl Moon, Proof Of Design

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