As many of you, I have spent time designing, fabricating, and assembling hybrid thick and thin film circuits. Just never found the "perfect" ceramic to metal seal. Have done Kovar/glass to metal seals as common practice. Have generally had good experiences with epoxy seals. Now, I'm faced with another "typical" seal type as Alloy 42/solder/solder to ceramic with mating metallization. My question is, considering the difficulty of always soldering effectively to the alloy, what works well? I'm talking here about the "cans" placed and sealed, maybe, to the substrate. Alternatives? Earl Moon, Proof Of Design --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------