Here it is. Good luck Kang >From: "Pelkey, Glenn" <[log in to unmask]> >Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, "Pelkey, Glenn" ><[log in to unmask]> >To: [log in to unmask] >Subject: Re: [TN] Temperature Cycle to product life >Date: Thu, 30 Nov 2000 09:20:34 -0800 > >Hi Lee, Werner, > > That "B" version was not easy to find. I couldn't find it on the >Jedec website or one of two document resellers. The reseller that did have >it shows it was issued 7/00/00 (interesting date). "A" version only goes >to >section 4.0, so I'm looking forward to the revision. > >Glenn > > > -----Original Message----- > > From: Werner Engelmaier [SMTP:[log in to unmask]] > > Sent: Wednesday, November 29, 2000 6:20 PM > > To: [log in to unmask] > > Subject: Re: [TN] Temperature Cycle to product life > > > > Hi Lee, > > You are quoting the wrong part of the JEDEC Standard. According to JEDEC > > Test > > Method, JESD22-A104-B, Section 5.7.2 warns specifically against high >ramp > > rates for solder joint testing. > > > > Werner Engelmaier > > Engelmaier Associates, L.C. > > Electronic Packaging, Interconnection and Reliability Consulting > > 7 Jasmine Run > > Ormond Beach, FL 32174 USA > > Phone: 904-437-8747, Fax: 904-437-8737 > > E-mail: [log in to unmask], Website: www.engelmaier.com > > > >--------------------------------------------------------------------------------- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >--------------------------------------------------------------------------------- [VY •VY _____________________________________________________________________________________ Get more from the Web. FREE MSN Explorer download : http://explorer.msn.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------