Hi technetters,

Is there any maximum thickness for the solder under SMT IC leads???

Or maximum distance between board surface and lead ?

I have a few cases where the leads are a bit lifted from the surface of the

board (at least one lead thickness) and the solder fills the gap

(enough to meet IPC req.). Does anyone see a non-conformancei n

this situation???

thank you in advance.

Reg.





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