ALTERA REFERS TO THESE AS "THERMALLY ENHANCED" BGA'S. INTERESTINGLY ENOUGH THEY SAY NO SPECIAL PROCESSING IS REQUIRED. I WILL BE READING ALL THE RESPONSES BECAUSE WE HAVEN'T HAD ALOT OF SUCESS WITH THESE PARTICULAR DEVICES EITHER. GOOD LUCK ----- Original Message ----- From: d. terstegge <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, October 10, 2000 10:25 AM Subject: Re: [TN] Heavy BGA's, now it's fine-pitch ! Hi Jim, Thanks for the suggestion. Any idea on how thick such a spacer should be, and how to apply it ? Like I mentioned, trial and error is no option for this project. Kind regards, Daan Terstegge SMT Centre Signaal Communications Unclassified mail Personal Website: http://www.smtinfo.net >>> "Marsico, James" <[log in to unmask]> 10/10 2:08 pm >>> How about using a temporary spacer under each corner? Jim M. -----Original Message----- From: d. terstegge [SMTP:[log in to unmask]] Sent: Tuesday, October 10, 2000 9:59 AM To: [log in to unmask] Subject: [TN] Heavy BGA's, now it's fine-pitch ! Hi Technet, I need your advice on this one: Some time ago there was a discussion about soldering problems with partnumberTMS320C6201GJC200 of Texas Instruments. It's a 1.27 mm pich BGA with a heavy heat-slug on top. The weight of the heat-slug makes the solderballs collapse a little too much, resulting in solder bridges. Now I've got to assemble some boards with similar parts, but with a much smaller ballpitch of only 0.8 mm. No problem for the ordinary type BGA's, but with the heatsink I'm starting to feel uncomfortable. For the record: it's TI's part numberTMX320C6203GLS. I've got to build two boards, and all I've got is two components. No trial and error possible...... If anyone of you have experience or thoughts about this, please let me know. Kind regards, Daan Terstegge SMT Centre Signaal Communications Unclassified mail Personal Website: http://www.smtinfo.net ---------------------------------------------------------------------------- ----- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------