Kemi Lewis, You may want to go to the NASA website which has their technical standards: http://starbase.msfc.nasa.gov/TSL/dispsearch.htm?agency=NASA&disp=E. The SMT specification that you are looking for is: NASA-STD 9739-2. You should get a copy of the IPC specifications IPC/EIA J-STD-001C and IPC-A-610C. While both are not recognized by NASA, they have good information for high reliability soldering specifications. You should try to get a copy of a JPL / NASA report: Ball Grid Array Packaging Guidelines; Dated August 1998, distributed by ITRI. Contact me directly offline for additional information. Good Luck Lee Whiteman Senior Manufacturing Engineer ACI / EMPF Telephone: (610) 362-1200; Ext. 208 FAX: (610) 362-1290 E-Mail: [log in to unmask] <mailto:[log in to unmask]> > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Kemi Lewis > Sent: Monday, October 09, 2000 11:55 AM > To: [log in to unmask] > Subject: [TN] Specific BGA Information > > > From: KEMI A. LEWIS > > Hi my name is Kemi lewis and i am an electrical engineer with kodak > commercial and government system. Cam anyone give me information on the > following: > > 1.) Use of BGAs in space applications > a) How they are effected in space via thermal radiation, > functionality over > temperature gradients ( 0 C to 100 C ) and thermal expansion. > b) > > 2.) Reliability information on plastic versus ceramic BGAs > a). over 100,000 cycles (5-10 yrs in space) > b). Full custom asic > c). Their respective CTEs (Coefficient of Thermal Expansion) with regards > to the board being mounted on such as kevlar or Thermount (plastic boards > use in computer etc..) > > > 3.) There are some alternate designs that are based on the traditional BGA > package called Dimple BGA and Column grid array. What does the industry > have to offer on information, especially reliability for these or > any other > alternate packages. > > 4.) What about inspection techniques. > > 5.) What about testability issues, can't probe pins on bottom of package. > Are there any guidelines for design and layout using BGAs. > > 6.) We need to use a 256 and 377 packages. Since our current die sizes are > 0.7 sq. inches. One with 175 pins with the 256 and the other with > 350 pins. > Both using a peak power of 600mW. > > 7.) Manufactuablity, any guidelines, best practices?? > > 8). Do you do Qualify packages for aerospace? > > Other topics: > Are there any vendors of space born Multi Chip Module (MCM) > > > If anyone can provide any information on any of the above it would be > greatly appreciated. > Sincerely > > > Kemi A. Lewis > Eastman Kodak > Commercial And Government Systems > Technical Operations > Electro-Optics and Electrical Engineering > hone: 716-726-5192 > > ------------------------------------------------------------------ > --------------- > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF TECHNET > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ------------------------------------------------------------------ > --------------- > --------------------------------------------------------------------------------- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------