Hello Tech-Netters I have a question regarding manufacturing output for solder paste stencil to Ceramic BGAs with non collapsing balls. For large BGA's (300+ pins) with non collapsing balls, there are a few issues with soldering onto normal circuitboards. The component is large and the board is seldom perfectly flat. Therefore, you may end up with some balls not fully contacting the solderpaste with a bad joint as result. I've learned that one method to solve this is to have a thicker layer of solderpaste to this component and that the manufacturers can add thickness selectively to the solder paste stencil. In this case, HOW should one best describe this in the CAD output? Would the manufacturer prefere a separate film with a filled area representing the component or are there other means that are better? Kind regards Per Viklund Dansk Data Elektronik AS / DDE Sverige AB / DDE USA Inc. mailto:[log in to unmask] http://www.dde-eda.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################