Cover the via with solder mask 'tenting Via's" Nancy Herzallah APW - Edrer Industries Tel: (414) 761 6575 ext 6639 Fax: (414) 7616563 www.apw1.com -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Salim Yusuf Sent: Monday, October 30, 2000 10:26 AM To: [log in to unmask] Subject: [TN] Via in Pad (VIP) Technology Does anyone out there have experience in designing apertures for D type pads that incorporates a via within it. The pads are for a 1206 resistor. Our current design is a circle which is offset from the front of the pad to eliminate solder balls, he foil thickness is 0.005" ( due to other fine pitch devices on the assembly . The solder fillet resulting from our current aperture design is just passable, but is definately bordering insufficient, due to the solder running down the via. Any help or advice on the following questions would be greatly appreciated: 1. How do I calculate how much solder volume ie required for a type of pad that incorporates a via hole within it ? 2. Can I over-print onto the solder mask ? 3. What other aperture designs are available for this type of pad ? Sal. ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------