Technetters, Need some help from all the soldering experts out there. We have a group of boards that show evidence of poor solder quality throughout the board. To the novice eye, it looks like the solder paste did not reflow completely. There appears to be small balls of unreflowed solder and small pin holes in some of the joints. Most of the quality group thinks that the profile was not hot enough. However, when the engineering group came to examine the joints, they stated, "Why No, these joints were just the opposite, they were liquidous too long!" Can I get some opinions on this? Any one out there with examples of solder joints that reflect these two scenarios would be appreciated. Please send them directly to me. We are having these joints cross sectioned, once the pictures come in I will forward to anyone interested. Thanks in advance of any help anyone can give. Carl Barnes Production Process Analyst ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################