Mike, Fluxing only would reduce the solder volume, and consequently, reduce the likelihood of bridging. By reducing solder volume, however, you reduce the attachment reliability of the resulting solder joint. This may not be required in all applications where excursion through temperature cycles, or long life are not required. This also varies based upon package type, construction, die size, etc. > Howard A. Cyker > Lucent Technologies > Email [log in to unmask] > Phone 978-960-2964 > Fax 978-960-1187 Pager 888-961-2336 > ---------- > From: Mike Sewell[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;[log in to unmask] > Sent: Tuesday, October 31, 2000 9:12 AM > To: [log in to unmask] > Subject: Re: [TN] Heavy BGA's, now it's fine-pitch ! > > Re: "Heavy BGAs" and "solder paste vs. flux paste", would only fluxing > appreciably reduce the solder volume (vs. applying solder paste) and hence > likelihood of bridging? Would it be worth the tradeoff in wetting...? > > Comments invited, > Mike Sewell > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > Search previous postings at: www.ipc.org > On-Line Resources & Databases > > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- > ------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------