Hello,
    If a microBGA is processed properly, would one expect all the solder joints to reflow properly?  I expect the answer is absolutely but has anyone experienced opens at the inner array of solder joints? Obviously issues like shadowing from neighboring parts should impact the reflow but does it?  
 
Furthermore, would any process associated with conformal coating affect the solder joints? 
 
Thanks in advance
 
regards.
 
Bill Kane