Does IPC address the following questions.  We design and build SMT
components for pcb construction.  If so, could somebody please specify where
these are referenced?

1.) Should the pad on the bottom of a component be rectangular or square or
is this important?
2.) Is there a "standard" pad size (like 2 x 2 mm)?
3.) Is there a simple design rule for optimizing the land pattern for the
pcb based on the component pad? We typically use 10 mils in each direction
but the inspection direction we use 20 mils.

Regards,

Mark Gilbert

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