Most packagers have different classes for humidity caretaking, e.g. Amkor which have 5 classes. Guess some IPC or JEDEC or other standards tell everything about this. Ingemar -----Original Message----- From: Marsico, James [mailto:[log in to unmask]] Sent: den 17 oktober 2000 18:37 To: [log in to unmask] Subject: Re: [TN] Measuring Moisture in BGA Packages. As far as I understand, ALL plastic BGAs will contain some degree of moisture and should always be baked out prior attachment. Thanks, Jim M. -----Original Message----- From: Brad L. Matthies [SMTP:[log in to unmask]] Sent: Tuesday, October 17, 2000 12:34 PM To: [log in to unmask] Subject: [TN] Measuring Moisture in BGA Packages. TN, Does anyone know of a simple (i.e., inexpensive) way to measure the moisture content in a BGA package? We have thought about measure the weight of parts, baking them out and remeasuring the weight to determine if it dropped. We have also considered using infrared imaging to look at the parts after applying some heat to them. Both of these seem problematic though. What we are trying to accomplish is to have our receiving inspectors sample parts to determine if the parts have a moisture contamination problem or not. We would then use this information to decide which parts need to be baked prior to being placed into dry storage for use in production. Any comments would be greatly appreciated. Regards, Brad L. Matthies SMT Process Engineer ---------------------------------------------------------------------------- ----- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------