Basically the rules are this: If a solder ball is loose (001 term) it is not encapsulated, entrapped or attached to a metal surface (610 terms). In both documents, this is a defect for all classes. If there are more that 5 solder balls that are <.13mm in diameter, within a 600 mm2 area, this is a process indicator for classes 2 and 3 (per 610, not covered in 001). If a solder ball is entrapped or encapsulated and is withing 0.13mm from a land or conductor, and does not violate minimum electrical clearance, this is a process indicator for classes 2 and 3 (per 610, not covered in 001). If a solder ball is >.13mm in diameter and is entrapped or encapsulated it is a process indicator for classes 2 and 3 (per 610, not covered in 001). Any solder ball violating minimum electrical clearance is a defect for all three classes in both documents. Anything else (e.g. a solderball <.13mm that is encapsulated and >.13mm from any conductor) is acceptable. Hope this helps. Mary Muller > ---------- > From: Steve Kelly[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Steve Kelly > Sent: Wednesday, October 04, 2000 12:47 PM > To: [log in to unmask] > Subject: [TN] FW: IPC-610C & J-STD-001C > > -----Original Message----- > From: Steve Kelly [mailto:[log in to unmask]] > Sent: Wednesday, October 04, 2000 3:32 PM > To: [log in to unmask] > Subject: IPC-610C & J-STD-001C > > When both documents are called up on a drawing how does one interpret the > solder ball issue. Section 6.5.3.1 in IPC-610C says 5 solder balls per > .093 > sq.in. as a process indicator. but the next paragraph says a defect is > present if the solder ball is not attached to a metal surface. I have > trouble interpreting J-STD-001C but I think I read zero solder balls. > Thanks > for the help. > > Steve Kelly > PFC Flexible Circuits Ltd. > (416) 750-8433 > [log in to unmask] > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################