Hi everyone, Does anyone have any info regarding the use of no clean flux versus O/A when building back plane assemblies? If O/A is preffered over no clean why? Isn't the main function of the solder joint primarily mechanical in this application? Thanks, SDK --------------------------------------------------------------------------------- TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF TECHNET Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------