Appreciate is someone can provide some expert advice on this. I have an assembly that requires the SMD attachments to be done first before the die attachment. The die attached adhesive requires to be cured at 175 degrees C for maximum efficiency for one hour. My susbstrate is FR4. My question is: are there any known problems on solder joint and PCB reliability issues if the assembly is additionally cured for one hour at 175 degrees C for the die attachment process? Are there any papers that have been published on this? Looking forward to your expert advice. Thanks & Best Regards Ng Kuan Kuan DSO National Labs Singapore ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################