We have build a set of boards here that have PQFP 304 (up to 4 per bd) with heat sinks on them and have had loads fun placing them. As mentioned elsewhere, we tried tackier pastes, moving them to the end of the pick and place program, adjusting the placement height in paste, and finally wound up tacking the corners (with a soldering iron) prior to reflow after hand placement of a few switches & LEDs. Not a good solution but .... One question: Have you verified your placement prior to any movement of the board? Sometimes heavier parts will shift on the nozzle after vision but before/during placement. Mike Sewell ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################