We're going through the same scenario right now and for the next ~18,000 assys. Same TH board that Steve G. has taken such a liking to. Massive amounts of cut/clip/rotate leads are required on this one. The problem is primarily with the DIP ICs on this board as they are laid out very close and have tracks running between the rows of leads on the bottom. If the design isn't "locked in stone" I'd suggest re-routing traces or perhaps adding another layer to cover the problem traces/conductors. If that isn't an option, you might stuff those parts loose formed and pretrimmed - provided its only a few per bd giving you trouble. Reducing the lead protrusion should make the lead less likely to bend in the field as more of the lead will be supported by the solder joint... Regards, Mike Sewell ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################