Hi, You do not have to go any farther than IPC-D-279, Appendix A. Werner Engelmaier In a message dated 09/21/2000 12:20:13 PM Central Daylight Time, [log in to unmask] writes: > Hi Technetters, > Does anyone know where I can find out more information about comparing > the solder joint reliability using Solder Mask define footprint vs > Copper define footprint? Or if you have any paper on this subject in > soft copy, please forward to me. > Alex Chan ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################