In a message dated 09/21/2000 12:20:13 PM Central Daylight Time, [log in to unmask] writes: > Hi Technetters, > > Does anyone know where I can find out more information about comparing > the solder joint reliability using Solder Mask define footprint vs > Copper define footprint? Or if you have any paper on this subject in > soft copy, please forward to me. > > Thanks, > Alex Chan Hi Alex! Go to: http://extra.ivf.se/ngl/E-BGA/ChapterE2.htm http://www.maxim-ic.com/1st_pages/UCSP.htm http://indy2.automata.com/newsroom_new/papers/evans/e2.htm http://indy2.automata.com/newsroom_new/papers/evans/e1.htm All these links have something in them about solder mask defined and non solder mask defined pads... -Steve Gregory- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################