We're experiencing a higher rate of insufficient solder on TC3528 size tantalum caps epoxied on the bottom side of the PCB then flow soldered with T/H components. The pads in question are on the low end or possibly a little under sized from what SM-782 recommends and I'm wondering if anyone using these parts in a similar manner has any recommendations for pad sizing to accommodate bottom side flow solder.? Thanks, Rick Thompson Ventura Electronics Assembly 2665A Park Center Dr. Simi Valley, CA 93065 +1 (805) 584-9858 voice +1 (805) 584-1529 fax [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################