We're experiencing a higher rate of insufficient solder on TC3528 size
tantalum caps epoxied on the bottom side of the PCB then flow soldered with
T/H components.  The pads in question are on the low end or possibly a
little under sized from what SM-782 recommends and I'm wondering if anyone
using these parts in a similar manner has any recommendations for pad sizing
to accommodate bottom side flow solder.?

Thanks,


Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
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