Hi,

In my designs, I need to use an area of my PCB as a heat sink for various
SMD packages.
I'm looking for some technical data or formula (a calculator perhaps) that
could show me just how big an area needs to be, to adequately dissipate an
amount of power for various SMD packages or body surfaces.

Even an article on the subject would be great.

Can anyone help me?

Thanks,

Jimmy Blier
CAD Department. (Supervisor)
P A R A D O X
S E C U R I T Y        S Y S T E M S
Email: [log in to unmask] <mailto:[log in to unmask]>
Phone:  (450) 491-7444
Fax:  (450) 491-5940