I would like to have the opinion of you knowledgeable people how have experience with this type of boards. We are designing our first Blind and Buried vias board these days. I wonder how I should specify on the Master Drawing the tolerances of these features . Specifically: Blind vias with FHS of 0.1 mm and minimum avg. Cu plating of 13 micron, what tolerance is usually spec'd for the hole .- I guess some tolerance have to be specified. Same questions for the Buried Via . Is it common to note on the drawings that (standard) Via holes don't need to be measured and may be partially closed with solder? and how would I go with OSP or gold finish for the same case. TIA Mickey Michael Weiner Tel (972-3) 9262937 Fax (972-3) 9261803 mailto:[log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################