Mike, We print paste and dispense adhesive as a rule. It adds quite a bit of insurance to the underside of our boards. We have experimented with no pasting, just wave-soldering. Our yields went down at ICT and open capacitors went through the roof. We run no-clean for the record. Hope this helps. Jason Gregory Manufacturing Supervisor ACT Manufacturing Corinth, MS. 38834 (662)287-3771 x470 [log in to unmask] > -----Original Message----- > From: Mike Sewell [SMTP:[log in to unmask]] > Sent: Friday, September 22, 2000 3:39 PM > To: [log in to unmask] > Subject: [TN] Bottom Side wave soldering of SMT parts > > We build a mixed technology board here with bottom side SMT (SOTs, small > chips, all laid out not to solder, ie..90 out from each other) and get > very > poor yield from wave (chip + lamda) solder. We print the adhesive on, > P&P, > cure, stuff, wave then TOUCH UP. My question is: what about printing > paste, > dispensing glue (or vice versa), P&P, reflow/cure, stuff, then wave? Will > having an existing joint make life easier on wave skips, or will the wave > disturb the skipped joints to the point of needing touch up? > > Haven't tried it yet because our dispenser is down, > Mike Sewell > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################