Hi Technetter,

I found copper whisker between patterns after copper electroplating process.
It cause short defect. At mean time, micro short was found very often. What
is the root cause? Someone told me that I should change Cu2SO4 solution in
copper plating process. The other guy recommend me to modify the
pretreatment condition of outer layer image transfer process. How can I
verify real root cause of copper whisker? Would you please provide your good
experience to me?

Howard Lin
Maxedge Electronic Corp.  MEC
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