Hi Technetter, I found copper whisker between patterns after copper electroplating process. It cause short defect. At mean time, micro short was found very often. What is the root cause? Someone told me that I should change Cu2SO4 solution in copper plating process. The other guy recommend me to modify the pretreatment condition of outer layer image transfer process. How can I verify real root cause of copper whisker? Would you please provide your good experience to me? Howard Lin Maxedge Electronic Corp. MEC [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################