Hi Thomas & All -
The laminate you suggest is a very stable one, but can be
affected greatly by the copper content of your design. Having used the
non-woven aramide fiber/polyimide resin content materials in the past, I would
strongly urge you to have design specimen tested in the areas of you critical
devices. My findings have been that the higher density devices, such as
BGA's can have sufficient copper content to arrive at a 17 PPM/degC expansion
rate. This will be localized, based on copper content of the underlying
structure.
On the positive side, the laminate is wonderfully stable for
processing. Your fabricator will need to do some prep work to be able to
handle it reliably.
Regards - Kelly
Dear Technetters,
we are currently investigating non-woven aramide
reinforced PI (Poly-Imide) materials for multilayer PWB fabrication. Our
requirement is light weight and high temperature (150 deg C = 300 deg F)
environment, further low TCE to reduce thermal expansion mismatch to large
ceramic components.
Formerly we have used metal core multilayer boards, but
now we need to save weight. Who can give us advice on material selection or
share experience with manufacturing (selection of core and prepreg material)
and durability at this high use temperature?
Any help will be appreciated
Best regards,
Thomas Ahrens