Dear all,

 

Pl. guide me to any lit. on benchmarks in PCB manufacturing. I am looking for some simple areas -

say

 

1. Drill bits broken per 1000 used. by size of course.

2. Max. holes per drill - incl. regrounds.

3. First pass yields on 3 mil to 6 mil imaging on boards - D.S. or inner layers.

4. Net yields - first pass by class

5. Consumption variance with ideal - PTH chemistry / Gold consumption/ PISM / DRY Film / and above all Laminate.

 

On assembly side

 

1. Defective assemblies - attributed to PCB s 

2. Solder joint - ppm defect first pass - for thru hole areas / SMT - by surface finish.

3. Solder mask problems as % of boards / area processed.

 

In case there is no recent study - I put it to all of you out there that we float a questionnaire in a std. format which we fill up "honestly " and send to IPC? TN ? to be compiled by size of plant / type of PCB/ complexity etc and give us the results with no names on it.

 

May be we will all know where we stand and how far to go - whichever way it be - up / down or out.

 

Anil Kher