Hi, I've been trying to determine IPC specs for a particular Hot Air Solder Leveling "defect". Below is a electronic photo of the defect. <<...OLE_Obj...>> This "defect" is called a solder tail, and I'm trying to determine when it's actually a defect and why. I know that if the "tail" stretches and contacts another annular ring, then it's defective because of bridge or short. If the surface plane of the annular ring is compromised by the excessive solder at the base of the tail, then it's defective because the annular ring needs to have a smooth even surface for the assembly of the surface mount. Other than these issues, is there any other reason why this "tail" would be defective? If the presence of the tail doesn't create an uneven surface for the annular ring, and if the tail doesn't contact any other features it should be acceptable, right? I appreciate whatever help you could give me. Thanks. Mike. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################